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Spezifikation für Freigabe / specification for release
Kunde / customer :
Artikelnummer / part number :
Bezeichnung :
82.307.050.029
description :
0402 ESD ULTRA LOW CAP TVS
SMD size: 0402
C L?tpad / soldering spec. :
RECOMMENDED SOLDER PAD LAYOUT
(Unit : mm)
A
SISE
402
603
A
0.4~0.6
0.8~1.2
B
1.0~1.8
1.7~3.0
C
0.6~0.7
1.2~1.6
D
0.6~1.2
0.9~1.8
805
1206
1210
1812
2220
3220
1.0~1.5
1.8~2.5
1.8~2.5
2.5~3.5
3.5~4.6
5.2~6.4
2.1~3.8
3.0~5.8
3.2~6.1
4.0~7.3
5.0~8.5
9.5~10.8
1.5~2.1
1.8~2.6
2.8~3.8
3.3~4.5
5.2~6.2
5.6~6.0
1.1~2.3
1.2~3.3
1.3~3.5
1.5~3.8
1.5~3.9
2.0~2.8
D
B
C
1 - The solder paste shall be printed in a thickness of 150 to 200 μ m.
2 - The SIR test of the solder paste shall be done （ Based on JIS-Z-3284 ）
3 - IR reflow Pb Free Process suggestin profile (Based on J-STD-020-C):
Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and gradual cooling process is
suggested. IR soldering has the highest yields due to controlled heating rates and solder liquidus times. Make sure that the element is not
subjected to a thermal gradient steeper than 3 degrees per second. 2 degrees per second is the ideal gradient. During the soldering process,
pre- heating to within 175 degrees of the solders peak temperature is essential to minimize thermal shock.
4 - Soldering recommend paste is Sn 96.5/Ag 3.5
275
Peak Temp.
260°C
- Preheat
1.The temperature rising speed is suggested to be 2~3 ℃ /s.
2.Appropriate preheat time will be from 60 to 120 seconds.
3.Temp. maintain at 175 +/-25°C 120 seconds.
- Heating
250
225
200
175
(3 to 10sec)
1.Careful about sudden rise in temperature as it may worsen
the solder ability.
2.Set the peak temperature in 235 ℃ 10-20s or 260°C 3-10s.
- Cooling
1.Ramp down rate 6°C/s max.
150
125
100
75
25
Peak Temp.
175°C
(60 to 120sec)
Peak Temp.
245°C
(10 to 20sec)
※ Perform adequate test in advance as the reflow temperature
01:00:00
02:00:00
03:00:00
04:00:00
profile will vary according to the conditions of the manufacturing
process, and the specification of the reflow furnace
Time (mn)
4 - Wave Soldering Process
Ramp-up rate 3°C/s max.
Temp. maintain at 175 +/-25°C 180 seconds max.
Peak temperature 260°C 3-10s.
Ramp down rate 6°C/s max.
to thermal shock, a preheat is recommended in the soldering
process. and the peak temperature should be under controlled
rigidly in the solder process.
5 - Hand Soldering Process
Preheating 150°C
Temperature of soldering iron tip 380°C max. 3 to 5 sec
275
250
225
200
175
150
125
100
75
25
Peak Temp.
260°C
(3 to 10sec)
Preheat.
175°C 150sec max.
The Varistorrs shall be cooled gradually at room ambient temperature
01:00:00
02:00:00
03:00:00
Time (mn)
04:00:00
6 - Ultrasonic cleaning
For preventing failures or damages. Frequency 29MHz max - radied Power 20W/l max - Period 5mn max
Würth Elektronik eiSos GmbH & Co.KG - Radialex department
D-74638 Waldenburg · Max-Eyth-Stra?e 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400
http://www.we-online.com
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